Machine combination:

Hw-t300a-3 three position laminating machine 4 sets

Hw-d300 high speed small hole socket die cutter 3 sets

Hw-q300 computer independent slicer 1 set

Process parameters:

Connection length: 17m

Production efficiency: 6000-18000pcs / h

Die cutting accuracy: ± 0.05mm

Power requirements: AC / 220V

Air source requirements: 0.6-0.8mpa

Power of the whole line: 20.2kw

technological process:

Material compounding → punching the inner hole of the product → discharging the waste compound glue → punching the product handle → discharging the waste compound glue → punching the outer frame of the product → discharging the waste → slice forming and receiving the material

Application fields:

FPC soft PSA tape die-cutting application for PCB of digital products such as mobile phone, computer, navigator and automobile tablet.